Study on the influence of technological parameters on the formation of a chemical nickel plating layer on fiberglass/polyamide composite

Authors

  • Dinh Van Long Institute of Materials, Biology and Environment/Academy of Military Science and Technology
  • Doan Minh Cuong (Corresponding Author) Institute of Materials, Biology and Environment/Academy of Military Science and Technology
  • Doan Tuan Anh Institute of Materials, Biology and Environment/Academy of Military Science and Technology
  • Dao The Nam Institute of Materials, Biology and Environment/Academy of Military Science and Technology
  • Mai Van Phuoc Institute of Materials, Biology and Environment/Academy of Military Science and Technology
  • Pham Thi Phuong Institute of Materials, Biology and Environment/Academy of Military Science and Technology

DOI:

https://doi.org/10.54939/1859-1043.j.mst.IMBE.2025.76-81

Keywords:

Chemical nickel plating; Fiberglass/polyamide composite.

Abstract

This study investigates the effects of temperature, plating time, and plating area-to-solution volume ratio on the formation of chemical nickel plating layers on fiberglass/polyamide composites. The experimental results demonstrate that optimal plating conditions are achieved at temperatures ranging from 75 to 80 °C. A minimum plating duration of 45 minutes is required to ensure adequate layer quality, characterized by electrical resistance ≤ 1.5 Ω and layer thickness ≥ 6 μm. Furthermore, the optimal plating area-to-solution volume ratio is determined to be within the range of 2.5:1 to 3.0:1 (dm²/L). These findings provide critical process parameters for achieving consistent and reliable chemical plating performance on composite substrates.

References

[1]. Mai Thanh Tung, "Plating technique on plastic substrate", Bach Khoa Publishing House, Hanoi, (2008).

[2]. Dinh Van Long and associates, “Study of nickel or copper chemical plating on some rocket details with composite polyamide and AΓ-4в materials”, Journal of Military Science Technology, No. 64, (2019).

[3]. Hui Zhang, Lanping Shen and Juan Chang, "Comparative Study of Electroless Ni-P, Cu, Ag and Cu-Ag Plating on Polyamide Fabrics", Journal of Industrial Textiles, School of Textile & Materials, Shaanxi Province, China, (2011).

[4]. Junjun Huang, Zhiping Sun, Fang Zhou, Yuan Yuan, “Method for electroless nickel plating on poly(ethylene terephthalate) substrates and through holes modified with primer”, Journal of Materials Science: Materials in Electronics 28 (15):1-7, (2017).

[5]. Zhiping Sun, Junjun Huang, Qi Liu, Min Gao, “Effects of temperature on Ni coating on poly(ethylene terephthalate) substrate modified with primer”, Journal of Material Science: Materials in Electronics 27(6), (2016).

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Published

18-11-2025

How to Cite

[1]
Dinh Van Long, Doan Minh Cuong, Doan Tuan Anh, Dao The Nam, Mai Van Phuoc, and Pham Thi Phuong, “Study on the influence of technological parameters on the formation of a chemical nickel plating layer on fiberglass/polyamide composite”, JMST, no. IMBE, pp. 76–81, Nov. 2025.

Issue

Section

Chemistry, Biology & Environment

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