Fabrication of lead-plated copper negative grid for high-capacity lead-acid battery
DOI:
https://doi.org/10.54939/1859-1043.j.mst.IMBE.2025.193-199Keywords:
Lead-acid battery; Lead plating; Fluoroborate plating solution; Copper mesh plating.Abstract
This paper presents the results of an investigation into the properties of a lead-plated layer on the negative electrode grid of a foreign-manufactured high-capacity lead-acid battery. The material composition, the plating layer's thickness and structural morphology were all ascertained using SEM and EDX analysis techniques. This analysis served as a benchmark for developing a lead plating technology on expanded copper mesh using a lead fluoroborate bath. The findings have provided a technological regime for producing a lead plating layer using the electrolytic plating method that satisfies the structural morphology and thickness technical requirements of the foreign-made grid sample.
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