A solution to improve heat dissipation for closed circuit board chassis
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https://doi.org/10.54939/1859-1043.j.mst.84.2022.159-162Keywords:
Heatsink chassis; Enclosed circuit board; Convection heat dissipation.Abstract
This paper presents the results of research on a solution to increase the heat dissipation for the enclosure containing the closed circuit board using a blower to circulate the air inside. Building models and methods to solve heat transfer problems. On that basis, investigating the influence of air flow velocity on the temperature difference between the inside and the outside environment and the chip surface temperature. The article also proposes to choose the right type of blower for a heat dissipation plan with a specific heat source capacity and conduct verification tests. The research results of the article can be applied when designing a heatsink housing containing a closed circuit board.
References
[1]. H. Y. Li, M. H. Chang, C. I. Lee, W. J. Yang, “Thermal performance of plate –fin vapor chamber heat sinks,” Int. Commun. Heat Mass Transf. 37(7), pp 731-738, (2010). DOI: https://doi.org/10.1016/j.icheatmasstransfer.2010.05.015
[2]. Atrenne Intergrated Solutions “Choosing the right cooling methodology”, Atrenne.com, (2016).
[3]. Mike DeGaetano, “Thermal Management for VIA™ and ChiP™ Modules”, Vicor Corporation, (2017).
[4]. H. E. Ahmed, B. H. Salman, A. S. Kherbeet, M. I. Ahmed, “Oprimization of thermal design of heat sinks: A review”, Int. J. Heat Mass Transf., vol. 18, pp. 129-153, (2018). DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2017.10.099
[5]. W. D. Jheng, S. H. Chen, Z. Y. Lin, “The efficiency of thermoelectric chip by different heat sink”, Appl. Mech. Mater., Vol. 121-126, pp. 2974-2978, (2012). DOI: https://doi.org/10.4028/www.scientific.net/AMM.121-126.2974
[6]. N. Bốn, H. N. Đồng, “Nhiệt kỹ thuật”, NXB Giáo dục (1999).
[7]. B. Hải, H. N. Hồng, “Bài tập Kỹ thuật nhiệt”, NXB Khoa học và Kỹ thuật (1999).
[8]. A. Amoako, J. Doom, “Optimization of heat sinks in a range of configurations”, Jt. Thermophys. Heat Transf. Conf., (2018). DOI: https://doi.org/10.2514/6.2018-2945
[9]. V. C. Hải, H. D. Hùng, L. Quốc, L. H. Anh, “Kỹ thuật nhiệt”, NXB Khoa học và Kỹ thuật (2012).
